The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2018
Filed:
Dec. 20, 2013
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H05K 3/30 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H05K 1/115 (2013.01); H05K 1/183 (2013.01); H05K 3/181 (2013.01); H05K 3/30 (2013.01); H05K 3/4611 (2013.01); H05K 3/4688 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/8203 (2013.01); H01L 2924/15153 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); Y10T 156/10 (2015.01);
Abstract
Provided are a printed circuit board and a method of manufacturing the printed circuit board, the printed circuit board including: a first element and a second element; a first base substrate including an embedding part in which the first element is embedded and a cavity into which the second element is mounted; and a second base substrate bonded to one surface of the first base substrate and including a first via for the second element.