The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Jan. 14, 2016
Applicant:

Hyundai Mobis Co., Ltd, Seoul, KR;

Inventor:

Hyun Woo Kang, Yongin, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 19/00 (2006.01); H05K 1/18 (2006.01); F21S 41/19 (2018.01); F21S 41/141 (2018.01); F21S 43/19 (2018.01); F21S 43/14 (2018.01); H01L 25/16 (2006.01); H05K 1/05 (2006.01); F21Y 103/10 (2016.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); F21S 41/141 (2018.01); F21S 41/192 (2018.01); F21S 43/14 (2018.01); F21S 43/195 (2018.01); H05K 1/05 (2013.01); F21Y 2103/10 (2016.08); H01L 25/167 (2013.01); H01L 2924/0002 (2013.01); H05K 1/056 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10174 (2013.01); H05K 2201/10189 (2013.01);
Abstract

Disclosed is a light emitting diode (LED) package for a lamp of a vehicle. The LED package includes a printed circuit board (PCB) which includes a metal layer, an insulating layer formed on the metal layer, and an electric wiring layer formed on the insulating layer; an LED circuit unit which includes an LED chip mounted on the electric wiring layer; and a connector which is mounted on the electric wiring layer to be connected with the LED chip. Area and thickness of the printed circuit board and position of the LED chip on the printed circuit board can be determined based on thermal resistance of the LED chip and thermal resistance of the PCB.


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