The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Dec. 09, 2014
Applicant:

Multek Technologies Ltd., San Jose, CA (US);

Inventors:

Mark Bergman, Redwood City, CA (US);

Joan K. Vrtis, Mesa, AZ (US);

Assignee:

Multek Technologies Ltd., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/22 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 3/22 (2013.01); H05K 2201/05 (2013.01);
Abstract

A rip stop material is attached at a stress area of a flexible circuit board in order to strengthen the flexible circuit board and minimize ripping and cracking in the polyimide and/or the copper conductors of the circuit. A rip stop transition layer is formed and deposited at a location on the flexible circuit in order to minimize, reduce, if not preventing cracking and ripping of the circuit as it is bent and flexed. The rip stop transition layer can be placed at different locations on and within the flexible circuit in order to minimize cracking and ripping as the flexible circuit is bent, flexed and twisted.


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