The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Nov. 03, 2017
Applicant:

Molex, Llc, Lisle, IL;

Inventors:

Koji Chikano, Setagaya, JP;

Makiko Ikeda, Yamato, JP;

Kazushige Asakawa, Yokohama, JP;

Assignee:

Molex, LLC, Lisle, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 12/73 (2011.01); H01R 12/71 (2011.01); H01R 13/436 (2006.01); H01R 12/70 (2011.01); H01R 12/72 (2011.01); H01R 13/26 (2006.01); H01R 12/52 (2011.01); H05K 3/36 (2006.01); H01R 13/422 (2006.01);
U.S. Cl.
CPC ...
H01R 12/716 (2013.01); H01R 12/52 (2013.01); H01R 12/707 (2013.01); H01R 12/724 (2013.01); H01R 13/26 (2013.01); H01R 13/4361 (2013.01); H01R 13/4223 (2013.01); H05K 3/368 (2013.01); H05K 2201/10189 (2013.01);
Abstract

A connector is provided that has a terminal, a housing for retaining the terminal, and a reinforcing bracket retained in the housing. The housing includes a fitting concave portion that fits with a counterpart connector and a bottom plate portion that faces a surface of a substrate. The terminal includes a contact portion that makes contact with a counterpart terminal of the counterpart connector inside the fitting concave portion and a substrate connecting portion exposed from a lower surface of the bottom plate portion and connected to a connecting pad on the surface of the substrate. The reinforcing bracket includes a main body portion retained in the housing inside the fitting concave portion and a leg portion exposed from the lower surface of the bottom plate portion and connected to the connecting pad on the surface of the substrate.


Find Patent Forward Citations

Loading…