The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Mar. 25, 2013
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Chengdu Boe Optoelectronics Technology Co., Ltd., Chengdu, Sichuan Province, CN;

Inventors:

Xiaodan Wei, Beijing, CN;

Xingqiang Zhang, Beijing, CN;

Zhong Lu, Beijing, CN;

Dongkoog Jang, Beijing, CN;

Assignees:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/04 (2006.01); H01L 29/10 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); H01L 27/1218 (2013.01); H01L 27/1248 (2013.01); H01L 27/1259 (2013.01); H01L 29/66765 (2013.01); H01L 29/78678 (2013.01);
Abstract

A method for fabricating an array substrate, an array substrate and a display device are provided. The method for fabricating the array substrate includes: forming a spacer layer on the array substrate, the spacer layer is disposed under a planarized layer and corresponds to a location of a via hole in the planarized layer, wherein the planarized layer is formed of a hot melt material.


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