The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Nov. 20, 2017
Applicant:

Sii Semiconductor Corporation, Chiba-shi, Chiba, JP;

Inventor:

Hirofumi Harada, Chiba, JP;

Assignee:

ABLIC Inc., , JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/52 (2006.01); H01L 23/525 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5258 (2013.01); H01L 24/00 (2013.01);
Abstract

A semiconductor integrated circuit device capable of stably forming a fuse element that is used to adjust the characteristics of the semiconductor integrated circuit device, and a method of manufacturing the semiconductor integrated circuit device are provided. The thickness of an interlayer insulating film above the fuse element is reduced by using an amorphous silicon layer that is formed by sputtering as a material of the fuse element, and by forming the amorphous silicon layer at the same time as metal wiring is formed. The steady ease of laser trimming processing is thus accomplished in the semiconductor integrated circuit device and the method of manufacturing the semiconductor integrated circuit device.


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