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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10014241 B1

PDFFull Text
Date of Patent:
Jul. 03, 2018

Filed:

Dec. 27, 2017

Semiconductor device

Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Akihiro Koga, Kyoto, JP;

Taro Nishioka, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Jasmine Clark

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/29 (2006.01); H01L 23/49 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49548 (2013.01); H01L 23/293 (2013.01); H01L 23/3107 (2013.01); H01L 23/3114 (2013.01); H01L 23/49 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 24/42 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/32 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48177 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/1715 (2013.01); H01L 2924/181 (2013.01);
Abstract

A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.

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