The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2018
Filed:
Dec. 14, 2015
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Shinichi Kooriyama, Kirishima, JP;
Narutoshi Ogawa, Kirishima, JP;
Masashi Konagai, Kirishima, JP;
Kensou Ochiai, Kawasaki, JP;
Noritaka Niino, Kirishima, JP;
KYOCERA CORPORATION, Kyoto, JP;
Abstract
A circuit board includes an insulating substrate; a metal circuit sheet joined to a first principal surface of the insulating substrate; and a heat dissipating sheet made of metal and joined to a second principal surface of the insulating substrate, the second principal surface being opposite the first principal surface. The thickness of the heat dissipating sheet is at least 3.75 times the thickness of the metal circuit sheet. The size of metal grains contained in the heat dissipating sheet is smaller than the size of metal grains contained in the metal circuit sheet, and decreases with increasing distance from the second principal surface of the insulating substrate.