The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Feb. 25, 2015
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventor:

Yoshiki Kawazu, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/057 (2006.01); H01L 23/04 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
H01L 23/04 (2013.01); H01L 23/057 (2013.01); H01L 23/12 (2013.01); H05K 1/0219 (2013.01); H05K 1/117 (2013.01);
Abstract

An electronic component containing package includes a substrate including a placement region for placing an electronic component in an upper face thereof; a frame disposed on the upper face of the substrate surrounding the placement region, and including a penetration part opening; and an input/output member disposed in the frame closing the penetration part, including a plurality of wiring conductors which extend inward and outward of the frame and are electrically connected to the electronic component. The input/output member includes via conductors which are connected to the wiring conductors and embedded at sites overlapping with the wiring conductors within a region surrounded by the frame in the input/output member, and a ground layer disposed in a surrounding of lower ends of the via conductors being spaced from the via conductors. Improved high frequency characteristics can be achieved.


Find Patent Forward Citations

Kawazu, Yoshiki. (2018). Electronic component containing package and electronic device (U.S. Patent No. 10014233). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10014233

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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