The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Nov. 29, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Ji Eon Yoon, Hwaseong-si, KR;

Chul Kim, Seongnam-si, KR;

Sang Moon Lee, Suwon-si, KR;

Seung Ryul Lee, Incheon, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/32 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02639 (2013.01); H01L 21/0265 (2013.01); H01L 21/02381 (2013.01); H01L 21/02521 (2013.01); H01L 21/02598 (2013.01); H01L 21/02647 (2013.01); H01L 29/32 (2013.01); H01L 21/02532 (2013.01); H01L 21/02538 (2013.01); H01L 21/02642 (2013.01);
Abstract

A semiconductor single crystal structure may include a substrate; a defect trapping stack disposed on the substrate; and a semiconductor single crystal disposed on the defect trapping stack, and having a lattice mismatch with a crystal of the substrate, in which the defect trapping stack may include a first dielectric layer disposed on the substrate, and having at least one first opening, a second dielectric layer disposed on the first dielectric layer, and having at least one second opening, a third dielectric layer disposed on the second dielectric layer, and having at least one third opening, and a fourth dielectric layer disposed on the third dielectric layer, and having at least one fourth opening, and in which the semiconductor single crystal may extend to a region of the substrate defined in the at least one first opening through the at least one first to fourth opening.


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