The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Jul. 30, 2014
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Boon Bing Ng, Singapore, SG;

Thida Ma Win, Singapore, SG;

Ning Ge, Palo Alto, CA (US);

Jose Jehrome Rando, Salisbury Downs, AU;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 16/06 (2006.01); B41J 2/045 (2006.01); G11C 19/28 (2006.01); B41J 2/175 (2006.01);
U.S. Cl.
CPC ...
G11C 16/06 (2013.01); B41J 2/17546 (2013.01); G11C 19/28 (2013.01);
Abstract

A split memory bank may comprise a number of memory matrices forming a memory bank and a shift register in which the shift register physically separates the matrices. An integrated circuit may comprise a number of shift registers and a plurality of memory matrices forming a memory bank in which the matrices are spatially separated by the shift register. An integrated printhead may comprise a number of memory banks each comprising a plurality of memory matrices and a number of shift registers in which each shift register spatially separates a number of the matrices.


Find Patent Forward Citations

Ng, Boon. (2018). Split memory bank (U.S. Patent No. 10014055). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10014055

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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