The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Aug. 30, 2012
Applicants:

Hiromi Murayama, Nagaokakyo, JP;

Noboru Kato, Nagaokakyo, JP;

Inventors:

Hiromi Murayama, Nagaokakyo, JP;

Noboru Kato, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 7/00 (2006.01); H01Q 1/24 (2006.01); G06K 19/077 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07749 (2013.01); H01Q 1/2225 (2013.01); H01Q 1/2283 (2013.01); H01Q 7/00 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/181 (2013.01);
Abstract

A wireless communication module and a wireless communication device that are less likely to become detached even when attached to a flexible base substrate and have a reduced height includes a flexible multilayer substrate including a plurality of stacked flexible base materials and a cavity provided therein, a wireless IC chip arranged in the cavity, and a sealant filled in the cavity so as to cover the wireless IC chip. The sealant is a material that is harder than the flexible base materials. The flexible multilayer substrate includes a loop-shaped electrode defined by coil patterns. The loop-shaped electrode is electrically connected to the wireless IC chip.


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