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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10012901 B1

PDFFull Text
Date of Patent:
Jul. 03, 2018

Filed:

Nov. 21, 2013

Photosensitive resin composition, resist laminate, and articles obtained by curing same (5)

Applicant:

Nippon Kayaku Kabushiki Kaisha, Tokyo, JP;

Inventors:

Naoko Imaizumi, Tokyo, JP;

Shinya Inagaki, Tokyo, JP;

Nao Honda, Tokyo, JP;

Assignee:

Nippon Kayaku Kabushiki Kaisha, Tokyo, JP;

Attorney:

Nields, Lemack & Frame, LLC

Primary Examiner:

Irina Krylova

Int. Cl.
CPC ...
G03F 7/004 (2006.01); G03F 7/038 (2006.01); C08G 59/38 (2006.01); C08L 63/00 (2006.01); G03F 7/075 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); C08G 59/06 (2006.01); C08G 59/22 (2006.01); C08G 59/24 (2006.01);
U.S. Cl.
CPC ...
G03F 7/004 (2013.01); B32B 27/08 (2013.01); B32B 27/32 (2013.01); C08G 59/063 (2013.01); C08G 59/226 (2013.01); C08G 59/245 (2013.01); C08G 59/38 (2013.01); C08L 63/00 (2013.01); G03F 7/038 (2013.01); G03F 7/0751 (2013.01); G03F 7/0755 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2307/71 (2013.01); B32B 2559/00 (2013.01);
Abstract

The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2).

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