The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Aug. 15, 2017
Applicants:

Xiamen Tianma Micro-electronics Co., Ltd., Xiamen, CN;

Tianma Micro-electronics Co., Ltd., Shenzhen, CN;

Inventor:

Liang Wen, Xiamen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/13 (2006.01); H01L 27/02 (2006.01); G02F 1/1362 (2006.01); H01L 21/311 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01); H01L 27/12 (2006.01); H01L 21/768 (2006.01); H01L 21/3213 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
G02F 1/136204 (2013.01); G02F 1/136227 (2013.01); H01L 21/31144 (2013.01); H01L 21/32134 (2013.01); H01L 21/76804 (2013.01); H01L 21/76805 (2013.01); H01L 27/0288 (2013.01); H01L 27/124 (2013.01); H01L 27/1222 (2013.01); H01L 27/1274 (2013.01); H01L 29/66757 (2013.01); H01L 29/78675 (2013.01); H01L 21/02532 (2013.01); H01L 21/02686 (2013.01);
Abstract

An array substrate is disclosed. The array substrate includes a substrate, a first film layer on a side surface of the substrate, an insulation layer on the side surface of the substrate, an electrostatic charge dispersion layer on the side surface of the substrate, and a second film layer arranged on the side surface of the substrate. The first film layer, the insulation layer, the electrostatic charge dispersion layer, and the second film layer are sequentially arranged on the substrate. In addition, the insulation layer and the electrostatic charge dispersion layer include via holes, the second film layer is electrically connected with the first film layer through the via holes, and the electrostatic charge dispersion layer is in a same profile as the second film layer.


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