The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2018
Filed:
Nov. 18, 2014
Corning Precision Materials Co., Ltd., Chungcheongnam-do, KR;
Gyung Soo Kang, Chungcheongnam-do, KR;
Bo Kyung Kong, Chungcheongnam-do, KR;
Eun Heui Choi, Chungcheongnam-do, KR;
Young Seon Park, Chungcheongnam-do, KR;
Woo Jin Lee, Chungcheongnam-do, KR;
Abstract
The present invention relates to a flexible substrate bonding method and, more particularly, to a bonding method for bonding a flexible substrate to a carrier substrate in order to facilitate handling of the flexible substrate. To this end, the present invention provides a flexible substrate bonding method comprising: a substrate preparation step for preparing a carrier substrate and a flexible substrate; and a bonding step for bonding the carrier substrate to the flexible substrate, which rotates by being wound around a rotation roll, while moving the carrier substrate by a transfer unit, wherein the bonding step includes bringing one edge of the flexible substrate into contact with the carrier substrate, and then gradually bonding the flexible substrate to the carrier substrate in a direction from one side to the other side.