The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Jul. 22, 2016
Applicant:

Stmicroelectronics (Crolles 2) Sas, Crolles, FR;

Inventors:

Jean-Francois Carpentier, Grenoble, FR;

Patrick Lemaitre, Biviers, FR;

Mickael Fourel, Grenoble, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/12 (2006.01); G02B 6/30 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
G02B 6/12002 (2013.01); G02B 6/12004 (2013.01); G02B 6/30 (2013.01); G02B 6/428 (2013.01); G02B 6/4232 (2013.01); G02B 6/4292 (2013.01); G02B 6/4269 (2013.01); H01L 23/13 (2013.01); H01L 23/49827 (2013.01); H01L 2224/16225 (2013.01);
Abstract

An integrated electronic device includes a substrate having an opening extending therethrough. The substrate includes an interconnection network, and connections coupled to the interconnection network. The connections are to be fixed on a printed circuit board. An integrated photonic module is electrically connected to the substrate, with a portion of the integrated photonic module in front of or overlapping the opening of the substrate. An integrated electronic module is electrically connected to the photonic module, and extends at least partly into the opening of the substrate. The electronic module and the substrate may be electrically connected onto the same face of the photonic module.


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