The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

May. 03, 2012
Applicants:

William C. Maier, Almond, NY (US);

Vince R. Volpe, Jr., Houston, TX (US);

Inventors:

William C. Maier, Almond, NY (US);

Vince R. Volpe, Jr., Houston, TX (US);

Assignee:

DRESSER-RAND COMPANY, Olean, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F01D 25/14 (2006.01); F01D 25/12 (2006.01); B23P 15/26 (2006.01); F01D 25/24 (2006.01); F28D 9/00 (2006.01); F04D 29/58 (2006.01); F04C 29/04 (2006.01); F28F 3/04 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
F01D 25/14 (2013.01); B23P 15/26 (2013.01); F01D 25/12 (2013.01); F01D 25/24 (2013.01); F04C 29/04 (2013.01); F04D 29/5826 (2013.01); F28D 9/0012 (2013.01); F04C 2230/00 (2013.01); F04C 2240/20 (2013.01); F28D 9/005 (2013.01); F28D 2021/004 (2013.01); F28F 3/048 (2013.01); F28F 2255/00 (2013.01); Y10T 29/49359 (2015.01);
Abstract

Apparatus for housing a rotatable component and exchanging heat and methods for manufacturing the same are disclosed. The apparatus includes a first casing and a second casing spaced apart from the first casing and defining a gap therebetween. The apparatus also includes a cooling fluid manifold coupled to a source of a cooling fluid, and a stack of plates coupled to the first and second casings and extending therebetween to fill the gap. The first and second casings and the stack of plates define at least a portion of a pressurized containment area therein. Further, the stack of plates includes a bore in which the rotatable component is received and defines process fluid flowpaths configured to direct process fluid to and/or from the rotatable component. The stack of plates is in fluid communication with the cooling fluid manifold and transfers heat from the process fluid to the cooling fluid.


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