The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2018
Filed:
Jan. 12, 2012
Pierre Banaszak, Vivegnis, BE;
Didier Marneffe, Engis, BE;
Bruno Schmitz, Nandrin, BE;
Eric Silberberg, Haltinne-Gesves, BE;
Luc Vanhee, Oisy-le-Verger, FR;
Pierre Banaszak, Vivegnis, BE;
Didier Marneffe, Engis, BE;
Bruno Schmitz, Nandrin, BE;
Eric Silberberg, Haltinne-Gesves, BE;
Luc Vanhee, Oisy-le-Verger, FR;
Arcelormittal Investigacion Y Desarrollo SL, Sestao, Bizkaia, ES;
Abstract
The present invention relates to a facility for the continuous vacuum deposition of a metal coating on a substrate in motion, comprising a vacuum deposition enclosure (), at least one vapor jet deposition head () connected to an evaporator pot () designed to contain the coating metal in liquid form (), through a vapor supply pipe () provided with a distribution valve (), and a melting furnace () for said metal, said furnace being at atmospheric pressure, located below the lowest portion of the evaporator pot () and connected to the evaporator pot () by at least one automatic supply pipe () of the evaporator pot () provided with a supply pump () and by at least one liquid metal return pipe (A,) optionally provided with a valve (), regulating means for the supply pump () further being present to regulate a determined liquid metal level in the evaporator pot (), characterized in that it comprises, in each said supply and return pipes (A,), a so-called heat valve area () provided with a heating device and a cooling device to obtain a regulated temperature, independent of that of the melting furnace (), that prevailing in the remaining portion of said pipes (A,) and in the evaporator pipe (), to melt or solidify the metal found in that location.