The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Aug. 14, 2015
Applicant:

H.b. Fuller Company, St. Paul, MN (US);

Inventors:

Sudipto Das, St. Paul, MN (US);

Henry P. Meyer, Stillwater, MN (US);

Anthony J. Ostlund, Centerville, MN (US);

Assignee:

H.B. Fuller Company, St. Paul, MN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09J 175/06 (2006.01); H05K 5/00 (2006.01); H05K 1/03 (2006.01); B32B 38/10 (2006.01); B32B 43/00 (2006.01); C08G 18/48 (2006.01); C08G 18/76 (2006.01); C08G 18/12 (2006.01); C08G 18/20 (2006.01); C08G 18/40 (2006.01); C08G 18/42 (2006.01); C09J 175/04 (2006.01);
U.S. Cl.
CPC ...
C09J 175/06 (2013.01); B32B 38/10 (2013.01); B32B 43/006 (2013.01); C08G 18/12 (2013.01); C08G 18/2081 (2013.01); C08G 18/4018 (2013.01); C08G 18/4202 (2013.01); C08G 18/4211 (2013.01); C08G 18/4238 (2013.01); C08G 18/4277 (2013.01); C08G 18/4825 (2013.01); C08G 18/7671 (2013.01); C09J 175/04 (2013.01); H05K 1/03 (2013.01); H05K 5/0017 (2013.01); B32B 2457/20 (2013.01); B32B 2457/208 (2013.01); C08G 2170/20 (2013.01);
Abstract

Disclosed is an article that includes a first substrate, a second substrate, and a re-workable adhesive composition, the first substrate being bonded to the second substrate through the adhesive composition. The adhesive composition is derived from a moisture curable polyurethane hot melt adhesive composition that includes a polyurethane prepolymer that includes the reaction product of a first crystalline polyester polyol having a number average molecular weight of from at least 5500 grams per mole (g/mol) to about 20,000 g/mol and a melting point of at least 40° C., and a polyisocyanate. The re-workable adhesive composition is cleanly removable from at least one of the first substrate and the second substrate after conditioning the article at a temperature of from at least 60° C. to no greater than 100° C. for a period of about 30 minutes.


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