The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Feb. 25, 2015
Applicant:

The Chemours Company Tt, Llc, Harrisburg, PA (US);

Inventors:

Andrew Jay Duncan, Wilmington, DE (US);

Jelena Lasio, Bel Air, MD (US);

Hau-Nan Lee, Wilmington, DE (US);

Carl Andrew Menning, Newark, DE (US);

Brad M Rosen, Philadelphia, PA (US);

Assignee:

THE CHEMOURS COMPANY FC, LLC, Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 7/65 (2018.01); C09D 7/61 (2018.01); C09D 7/40 (2018.01); C09C 1/36 (2006.01); C09C 3/08 (2006.01); C09C 1/30 (2006.01); C08J 3/05 (2006.01); C09D 133/00 (2006.01); C08K 9/08 (2006.01); C09D 5/03 (2006.01);
U.S. Cl.
CPC ...
C09D 7/65 (2018.01); C08J 3/05 (2013.01); C08K 9/08 (2013.01); C09C 1/3063 (2013.01); C09C 1/3669 (2013.01); C09C 3/08 (2013.01); C09D 5/031 (2013.01); C09D 7/61 (2018.01); C09D 7/70 (2018.01); C09D 133/00 (2013.01); C01P 2004/04 (2013.01); C01P 2004/34 (2013.01); C01P 2004/60 (2013.01); C01P 2004/61 (2013.01); C01P 2004/62 (2013.01); C01P 2004/64 (2013.01); C08J 2325/08 (2013.01); C08J 2333/10 (2013.01);
Abstract

This invention provides methods and technology related to increased hiding power of a coating through mediating the interaction of the pigment with other system components including but not limited to other pigment particles, latex paint particles, latex binding particles, and organic or inorganic hollow particles. Organization and spacing are tailored via pH sensitive functionalities hosted on ligands or polymeric spacers that are located at/within the surface of one of the components.


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