The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2018
Filed:
Sep. 08, 2015
Applicant:
Toshiba Memory Corporation, Tokyo, JP;
Inventors:
Akifumi Gawase, Mie, JP;
Yukiteru Matsui, Aichi, JP;
Takahiko Kawasaki, Aichi, JP;
Yosuke Otsuka, Mie, JP;
Hajime Eda, Kanagawa, JP;
Assignee:
Toshiba Memory Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/24 (2012.01); B24B 37/04 (2012.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01); B24B 37/042 (2013.01);
Abstract
In accordance with an embodiment, a polishing method includes supplying slurry to a surface of a polishing layer including a polymer, and bringing a polishing object into contact with the polishing layer to polish the polishing object. The polishing layer has a fibrous first substance mixed therein or contains a second substance. The second substance is higher in specific heat and higher in thermal conductivity than the polymer in such a manner that the second substance is surrounded by the polymer.