The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2018
Filed:
Apr. 28, 2015
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventors:
Kosuke Nakano, Nagaokakyo, JP;
Hidekiyo Takaoka, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/02 (2006.01); B23K 1/00 (2006.01); B23K 35/26 (2006.01); C22C 9/05 (2006.01); C22C 9/06 (2006.01); C22C 13/00 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01); B23K 35/36 (2006.01); B23K 35/362 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 35/025 (2013.01); B23K 1/00 (2013.01); B23K 1/0016 (2013.01); B23K 35/262 (2013.01); B23K 35/362 (2013.01); B23K 35/3613 (2013.01); C22C 9/05 (2013.01); C22C 9/06 (2013.01); C22C 13/00 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H05K 3/3484 (2013.01); B23K 2201/40 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/27 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/13294 (2013.01); H01L 2224/13311 (2013.01); H01L 2224/13347 (2013.01); H01L 2224/16503 (2013.01); H01L 2224/16507 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/32503 (2013.01); H01L 2224/32507 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81211 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83211 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01038 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01052 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01059 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/0665 (2013.01); H05K 2201/0215 (2013.01); H05K 2201/0272 (2013.01); Y10T 403/479 (2015.01); Y10T 428/31678 (2015.04);
Abstract
A solder paste including a metal component consisting of a first metal powder and a second metal powder having a melting point higher than that of the first metal, and a flux component. The first metal is Sn or an alloy containing Sn, the second metal is one of (1) a Cu—Mn alloy in which a ratio of Mn to the second metal is 5 to 30% by weight and (2) a Cu—Ni alloy in which a ratio of Ni to the second metal is 5 to 20% by weight, and a ratio of the second metal to the metal component is 36.9% by volume or greater.