The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Sep. 30, 2016
Applicant:

Ersa Gmbh, Wertheim, DE;

Inventors:

Rainer Kurtz, Wertheim, DE;

Michael Schaefer, Kuelsheim, DE;

Assignee:

ERSA GmbH, Wertheim, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 3/06 (2006.01); B23K 3/08 (2006.01); H05K 13/04 (2006.01); B23K 1/08 (2006.01); H05K 3/34 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 3/0638 (2013.01); B23K 1/085 (2013.01); B23K 3/0653 (2013.01); B23K 3/082 (2013.01); H05K 3/34 (2013.01); H05K 13/0465 (2013.01); B23K 2201/42 (2013.01);
Abstract

A soldering module for a soldering system for selective wave soldering, having at least one first and one second solder pot, wherein the solder pots are displaceable along an x-axis by means of an x-axis drive, along a y-axis by means of a y-axis drive, and along a z-axis by means of a z-axis drive, wherein the axes are all arranged orthogonally in relation to each other; wherein two y-axis drives and two moving devices are provided on which the solder pots are displaceable along the y-axis by means of the y-axis drives; wherein a first moving device is associated with the first solder pot, and wherein a second moving device which is different from the first moving device is associated with the second solder pot.


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