The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2018

Filed:

Feb. 16, 2015
Applicant:

Risto Tuominen, Helsinki, FI;

Inventor:

Risto Tuominen, Helsinki, FI;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0081 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H05K 1/185 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/20 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/01002 (2013.01); H01L 2924/01003 (2013.01); H01L 2924/0106 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01043 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01052 (2013.01); H01L 2924/01061 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30107 (2013.01); H05K 1/0218 (2013.01); H05K 2201/0723 (2013.01); H05K 2201/09318 (2013.01); H05K 2201/10674 (2013.01);
Abstract

An electronic module with EMI protection is disclosed. The electronic module comprises a component with contact terminals and conducting lines in a first wiring layer. There is also a dielectric between the component and the first wiring layer such that the component is embedded in the dielectric. Contact elements provide electrical connection between at least some of the contact terminals and at least some of the conducting lines. The electronic module also comprises a second wiring layer inside the dielectric. The second wiring layer comprises a conducting pattern that is at least partly located between the component and the first wiring layer and provides EMI protection between the component and the conducting lines.


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