The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2018

Filed:

Jun. 12, 2012
Applicants:

Hiroharu Inoue, Osaka, JP;

Koji Kishino, Fukushima, JP;

Inventors:

Hiroharu Inoue, Osaka, JP;

Koji Kishino, Fukushima, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/09 (2006.01); B32B 7/02 (2006.01); B32B 17/10 (2006.01); H05K 1/03 (2006.01); B32B 15/08 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/26 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/036 (2013.01); B32B 15/08 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/26 (2013.01); B32B 2250/40 (2013.01); B32B 2264/102 (2013.01); B32B 2307/204 (2013.01); B32B 2307/206 (2013.01); B32B 2457/08 (2013.01); H05K 3/022 (2013.01); Y10T 428/269 (2015.01);
Abstract

A metal-clad laminate according to the invention is provided with an insulating layer and a metal layer present on at least one surface side of the insulating layer. The insulating layer is formed by laminating at least two layers, which are a first resin layer and a second resin layer disposed between the first resin layer and the metal layer. The first resin layer and the second resin layer each include a cured product of a resin composition. The resin composition in the first resin layer is different from the resin composition in the second resin layer. A relative permittivity of the cured product of the resin composition included in the second resin layer is lower than a relative permittivity of the cured product of the resin composition included in the first resin layer.


Find Patent Forward Citations

Loading…