The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2018
Filed:
Mar. 07, 2014
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); C08J 5/18 (2006.01); C08K 7/02 (2006.01); C08L 101/00 (2006.01); G06F 3/041 (2006.01); H01B 1/02 (2006.01); H01L 31/0224 (2006.01); H05K 1/03 (2006.01); C08J 7/04 (2006.01); C09D 105/16 (2006.01); B32B 5/02 (2006.01); H01B 1/24 (2006.01); C09D 163/00 (2006.01); B32B 15/092 (2006.01); B32B 15/08 (2006.01); B32B 3/12 (2006.01); B32B 3/26 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); B32B 5/02 (2013.01); C08J 5/18 (2013.01); C08J 7/047 (2013.01); C08K 7/02 (2013.01); C08L 101/00 (2013.01); C09D 105/16 (2013.01); C09D 163/00 (2013.01); G06F 3/041 (2013.01); H01B 1/02 (2013.01); H01B 1/24 (2013.01); H01L 31/022466 (2013.01); H01L 31/022491 (2013.01); H05K 1/028 (2013.01); H05K 1/0213 (2013.01); H05K 1/0274 (2013.01); H05K 1/0296 (2013.01); H05K 1/0326 (2013.01); H05K 1/0333 (2013.01); H05K 1/0366 (2013.01); B32B 3/12 (2013.01); B32B 3/266 (2013.01); B32B 15/08 (2013.01); B32B 15/092 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/103 (2013.01); B32B 2262/106 (2013.01); B32B 2262/14 (2013.01); B32B 2307/202 (2013.01); B32B 2307/412 (2013.01); B32B 2307/50 (2013.01); B32B 2363/00 (2013.01); C08J 2300/21 (2013.01); C08J 2367/02 (2013.01); C08J 2400/21 (2013.01); C08J 2463/00 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/0326 (2013.01); Y10T 428/24331 (2015.01); Y10T 428/24917 (2015.01);
Abstract
The present invention is a resin composition characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to a resin composition wherein the stress relaxation rate (R) and the residual strain rate α, as measured in a prescribed extension-restoration test, are as follows: 20%≤R≤95% and 0%≤α≤3%.