The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2018

Filed:

Feb. 08, 2016
Applicant:

Semicon Light Co., Ltd., Gyeonggi-do, KR;

Inventors:

Eun Hyun Park, Gyeonggi-do, KR;

Soo Kun Jeon, Gyeonggi-do, KR;

Kyoung Min Kim, Gyeonggi-do, KR;

Dong So Jung, Gyeonggi-do, KR;

Kyeong Jea Woo, Gyeonggi-do, KR;

Assignee:

SEMICON LIGHT CO., LTD., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/20 (2006.01); H01L 33/60 (2010.01); H01L 33/56 (2010.01); H01L 33/48 (2010.01); H01L 33/00 (2010.01); H01L 33/20 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/486 (2013.01); H01L 33/56 (2013.01); H01L 33/0079 (2013.01); H01L 33/20 (2013.01); H01L 33/62 (2013.01);
Abstract

Disclosed is a semiconductor light emitting device, including: a body, which has a bottom part with at least one hole formed therein, a side wall, and a cavity defined by the bottom part and the side wall; a semiconductor light emitting chip, which is placed in each hole and includes plural semiconductor layers adapted to generate light by electron-hole recombination and electrodes electrically connected to the plural semiconductor layers; and an encapsulating member provided at least to the cavity to cover the semiconductor light emitting chip, in which the electrodes of the semiconductor light emitting chip are exposed towards the lower face of the bottom part of the body.


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