The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2018

Filed:

Mar. 10, 2016
Applicant:

Kaneka Corporation, Osaka-shi, Osaka, JP;

Inventors:

Gensuke Koizumi, Settsu, JP;

Daisuke Adachi, Settsu, JP;

Kunihiro Nakano, Settsu, JP;

Assignee:

KANEKA CORPORATION, Osaka-Shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 31/05 (2014.01); H01L 31/0747 (2012.01); H01L 31/0216 (2014.01); H01L 31/18 (2006.01); H01L 31/0224 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0504 (2013.01); H01L 31/02167 (2013.01); H01L 31/022425 (2013.01); H01L 31/022441 (2013.01); H01L 31/022475 (2013.01); H01L 31/0747 (2013.01); H01L 31/1884 (2013.01); H01L 31/022433 (2013.01);
Abstract

The solar cell includes: a first metal seed layer and a first plating layer provided on a first surface of a photoelectric conversion section; a second metal seed layer provided on a second surface of the photoelectric conversion section; and a third metal seed layer and a third plating layer provided on the lateral surface and the peripheral edge of the second surface of the photoelectric conversion section. The first metal seed layer is in electrical continuity with the third metal seed layer, while the second metal seed layer is in electrical non-continuity with the third metal seed layer. By supplying electricity to at least one of the first metal seed layer and the third metal seed layer, the first plating layer and the third plating layer are formed simultaneously.


Find Patent Forward Citations

Loading…