The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2018
Filed:
Nov. 09, 2016
Hyunsu Jun, Seongnam-si, KR;
Hyunsu Jun, Seongnam-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A semiconductor package device includes a first semiconductor package including a first package substrate and a semiconductor chip stacked on the first package substrate, and a second semiconductor package stacked on the first semiconductor package. The second semiconductor package includes a second package substrate, an image sensor chip stacked on the second package substrate, and a transparent substrate disposed on the image sensor chip. The first semiconductor chip may include a semiconductor memory device, a digital signal processor (DSP), an application specific integrated circuit (ASIC), and/or an image sensor driver circuit and may transfer, process and/or store signals output from the image sensor chip.