The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2018

Filed:

Sep. 14, 2016
Applicant:

Japan Display Inc., Tokyo, JP;

Inventor:

Noriyoshi Kanda, Tokyo, JP;

Assignee:

Japan Display Inc., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/32 (2006.01); H01L 27/12 (2006.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1288 (2013.01); H01L 27/3276 (2013.01); H01L 29/45 (2013.01); H01L 27/3265 (2013.01);
Abstract

A semiconductor device in an embodiment according to the present invention includes a first terminal and a second terminal stacked with a first conductive layer including titanium or molybdenum, a second conductive layer including aluminum above the first conductive layer, and a third conductive layer including titanium or molybdenum above the second conductive layer, a first insulation layer between the first terminal and the second terminal, a second insulation layer between the first insulation layer contacting a side wall part of the first terminal, and a fourth conducing layer extending an upper surface of the first terminal and an upper surface of the second insulation layer. The first terminal and the second terminal are arranged on an exterior side of a drive circuit including a semiconductor element.


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