The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2018

Filed:

Feb. 17, 2015
Applicants:

Infineon Technologies Bipolar Gmbh & Co. KG, Warstein, DE;

Siemens Aktiengesellschaft, Munich, DE;

Inventors:

Mario Schenk, Warstein, DE;

Jens Przybilla, Warstein, DE;

Reiner Barthelmess, Soest, DE;

Joerg Dorn, Buttenheim, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 25/11 (2006.01); H01L 25/07 (2006.01); H01L 23/40 (2006.01); H01L 23/32 (2006.01); H01L 23/367 (2006.01); H01L 23/473 (2006.01); H01L 23/00 (2006.01); H01L 23/051 (2006.01);
U.S. Cl.
CPC ...
H01L 25/115 (2013.01); H01L 23/051 (2013.01); H01L 23/32 (2013.01); H01L 23/3675 (2013.01); H01L 23/4006 (2013.01); H01L 23/473 (2013.01); H01L 24/72 (2013.01); H01L 25/072 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A disk cell for pressure contacting a plurality of semiconductor components via a clamping device to generate a clamping force. The disk cell includes a housing comprising at least one metallic pressure plate, a first semiconductor component arranged in the housing, and a second semiconductor component arranged in the housing. The first and second semiconductor components are different. The at least one metallic pressure plate reaches across and clamps the first and second semiconductor components, is substantially perpendicular to the clamping force, and is arranged so that the clamping force acts on the at least one metallic pressure plate to provide a local region of influence to clamp the first and second semiconductor components. The first semiconductor component is arranged below the local region of influence of the clamping force. The second semiconductor component is at least partially arranged outside the local region of influence of the clamping force.


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