The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2018

Filed:

Feb. 02, 2017
Applicant:

Dai Nippon Printing Co., Ltd, Tokyo, JP;

Inventor:

Masaaki Asano, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/42 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H01L 23/49894 (2013.01); H05K 1/115 (2013.01); H05K 3/42 (2013.01); H01L 24/17 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73257 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2924/15747 (2013.01);
Abstract

A through-electrode substrate includes a base including a first surface and a second surface mutually opposing each other, and a through-electrode arranged in a through-hole passing through the second surface from the first surface of the base, wherein the through-electrode includes an first end surface of the first surface side and an second end surface of the second surface side exposed from the base in the first surface and the second surface, and a periphery edge of one or both of the first end surface of the first surface side and the second end surface of the second surface side is covered by a part of the base.


Find Patent Forward Citations

Asano, Masaaki. (2018). Through-electrode substrate, method for manufacturing same, and semiconductor device in which through-electrode substrate is used (U.S. Patent No. 10008442). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10008442

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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