The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2018

Filed:

Dec. 01, 2015
Applicant:

Samsung Electronics Co., Ltd, Suwon-Si, Gyeonggi-do, KR;

Inventors:

Woo-Jin Lee, Hwaseong-si, KR;

Byung-Hee Kim, Seoul, KR;

Sang-Hoon Ahn, Goyang-si, KR;

Woo-Kyung You, Incheon, KR;

Jong-Min Baek, Seoul, KR;

Nae-In Lee, Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76807 (2013.01); H01L 21/76849 (2013.01); H01L 21/76885 (2013.01); H01L 23/5222 (2013.01); H01L 23/53295 (2013.01); H01L 21/76816 (2013.01); H01L 2221/1047 (2013.01);
Abstract

A method of forming a semiconductor device can include forming an insulation layer using a material having a composition selected to provide resistance to subsequent etching process. The composition of the material can be changed to reduce the resistance of the material to the subsequent etching process at a predetermined level in the insulation layer. The subsequent etching process can be performed on the insulation layer to remove an upper portion of the insulation layer above the predetermined level and leave a lower portion of the insulation layer below the predetermined level between adjacent conductive patterns extending through the lower portion of the insulation layer. A low-k dielectric material can be formed on the lower portion of the insulation layer between the adjacent conductive patterns to replace the upper portion of the insulation layer above the predetermined level.


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