The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2018
Filed:
Dec. 05, 2016
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); B24B 41/06 (2012.01); B24B 49/12 (2006.01); B24B 55/02 (2006.01); B24B 7/22 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); B24B 7/228 (2013.01); B24B 41/068 (2013.01); B24B 49/12 (2013.01); B24B 55/02 (2013.01); H01L 21/68714 (2013.01); H01L 21/67051 (2013.01);
Abstract
A substrate thinning apparatus includes a chuck table capable of supporting a substrate, a rotatable grinding device which includes a wheel tip capable of grinding the substrate supported by the chuck table, and a cleaning device configured to perform synchronized cleaning of the wheel tip while the grinding device is rotated. When the substrate thinning apparatus is used, even an extremely thin semiconductor device can be fabricated with substantial reliability.