The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2018
Filed:
Mar. 30, 2015
Siemens Aktiengesellschaft, Munich, DE;
SIEMENS AKTIENGESELLSCHAFT, Munich, DE;
Abstract
A method for mounting an electrical component to a substrate may include mounting the component onto the substrate, forming a cover including a thermally softenable or hardenable material and a contacting structure defined by integrated conductor paths, mounting the cover onto a mounting side of the substrate and onto the component mounted on the substrate, such that (a) the cover laterally traverses the component, (b) first contact surfaces of the contacting structure engage with the substrate at a first joining level defined at the mounting side of the substrate, and (c) second contact surfaces of the contacting structure engage with the component at a second joining level at the top side of the component, the second joining level being different than the first joining level. After assembling the components, joining connections at the first and second joining levels may be completed by a temperature or pressure based joining process.