The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2018
Filed:
Jun. 05, 2015
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Young Ghyu Ahn, Sunwon-Si, KR;
Byoung Hwa Lee, Suwon-Si, KR;
Sang Soo Park, Suwon-Si, KR;
Oh Choon Kwon, Suwon-Si, KR;
Hong Kyu Shin, Suwon-Si, KR;
Hyun Sub Oh, Suwon-Si, KR;
Jae Hyuk Choi, Suwon-Si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 15/00 (2013.01); H01G 4/38 (2006.01); H01G 4/30 (2006.01); H01G 9/15 (2006.01); H01G 9/012 (2006.01); H02M 1/08 (2006.01); H01G 4/40 (2006.01); H01G 9/28 (2006.01); H01G 2/10 (2006.01); H01G 4/232 (2006.01); H01G 4/12 (2006.01); H01G 9/042 (2006.01); H02M 3/335 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01G 15/00 (2013.01); H01G 2/106 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01G 4/38 (2013.01); H01G 4/40 (2013.01); H01G 9/012 (2013.01); H01G 9/28 (2013.01); H02M 1/08 (2013.01); H01G 4/12 (2013.01); H01G 9/042 (2013.01); H01G 9/15 (2013.01); H02M 3/33507 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01); Y02B 70/1433 (2013.01);
Abstract
A composite electronic component includes a composite body formed by combining a multilayer ceramic capacitor (MLCC) and a tantalum capacitor. The composite electronic component has an excellent acoustic noise reduction effect, low equivalent series resistance (ESR)/equivalent series inductance (ESL), enhanced DC-bias characteristics, and a reduced chip thickness.