The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2018

Filed:

Sep. 19, 2016
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Jason D. Wilson, West Linn, OR (US);

Mark Green, Newberg, OR (US);

Bill Emery, Sherwood, OR (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 3/041 (2006.01); G06F 3/042 (2006.01); G06F 3/044 (2006.01); B32B 7/12 (2006.01); B32B 5/14 (2006.01); B32B 7/02 (2006.01); B32B 7/04 (2006.01); B32B 15/00 (2006.01); B32B 15/04 (2006.01); B32B 17/06 (2006.01); B32B 37/00 (2006.01); B32B 37/02 (2006.01); B32B 37/12 (2006.01); B32B 37/14 (2006.01); B32B 37/18 (2006.01); B32B 38/14 (2006.01);
U.S. Cl.
CPC ...
G06F 3/041 (2013.01); B32B 5/142 (2013.01); B32B 7/02 (2013.01); B32B 7/045 (2013.01); B32B 7/12 (2013.01); B32B 15/00 (2013.01); B32B 15/04 (2013.01); B32B 17/06 (2013.01); B32B 37/0076 (2013.01); B32B 37/02 (2013.01); B32B 37/12 (2013.01); B32B 37/144 (2013.01); B32B 37/18 (2013.01); B32B 38/14 (2013.01); G06F 3/042 (2013.01); G06F 3/044 (2013.01); B32B 2250/42 (2013.01); B32B 2255/205 (2013.01); B32B 2307/202 (2013.01); B32B 2307/402 (2013.01); B32B 2307/412 (2013.01); B32B 2311/00 (2013.01); B32B 2315/08 (2013.01); B32B 2457/00 (2013.01); B32B 2457/208 (2013.01); G06F 2203/04103 (2013.01); Y10T 156/10 (2015.01);
Abstract

Different lamination methods may be used to create a touch sensor with a darkened side of metalized film facing the user. One lamination method includes laminating a metalized film to an optically clear adhesive (OCA) layer such that an edge of the metalized film including the termination pads remain un-adhered to the OCA layer. Flex-tails may be bonded to the termination pads at a later time by bending up the un-adhered edge. Anisotropic Conductive Film (ACF) may be placed on the termination pads prior to laminating the metalized films. Flex-tails may be placed onto an OCA layer in a location where the termination pads on the metalized film will be located when laminated to the OCA layer. A strip of ACF may be placed on the flex-tail pads. The flex-tails may be bonded to the termination pads of the metalized film prior to the metalized film being laminated.


Find Patent Forward Citations

Loading…