The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2018
Filed:
Aug. 28, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Joonyong Park, Suwon-si, KR;
Dongouk Kim, Pyeongtaek-si, KR;
Jihyun Bae, Seoul, KR;
Bongsu Shin, Seoul, KR;
Jong G. Ok, Seoul, KR;
Ilsun Yoon, Seongnam-si, KR;
Sunghoon Lee, Seoul, KR;
Jaeseung Chung, Suwon-si, KR;
Sukgyu Hahm, Gyeongju-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/3065 (2006.01); G02B 27/62 (2006.01); G02B 5/30 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
G02B 27/62 (2013.01); G02B 5/3058 (2013.01); G02F 1/13336 (2013.01);
Abstract
A master wafer includes: a plurality of unit wafers each including a pattern disposed thereon; a coupling surface defined on each of the unit wafers; and a coupling part which couples adjacent unit wafers among the plurality of unit wafers on which the coupling surface is defined, to each other.