The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2018

Filed:

Jul. 26, 2013
Applicant:

Analogic Corporation, Peabody, MA (US);

Inventors:

Randy Luhta, Chardon, OH (US);

Daniel Abenaim, Lynnfield, MA (US);

Martin Choquette, Exeter, NH (US);

Ruvin Deych, Gloucester, MA (US);

Chris Vrettos, Willoughby, OH (US);

Assignee:

ANALOGIC CORPORATION, Peabody, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01T 1/24 (2006.01); H01L 27/146 (2006.01); G01T 1/20 (2006.01);
U.S. Cl.
CPC ...
G01T 1/244 (2013.01); G01T 1/2018 (2013.01); H01L 27/14618 (2013.01); H01L 27/14661 (2013.01); H01L 2224/16225 (2013.01);
Abstract

Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. In some embodiments, at least some portions of the detector unit, such as the electronics sub-assembly, may be formed via a semiconductor fabrication technique. By way of example, an electronics sub-assembly may be formed via a semiconductor fabrication technique and may comprise electronic circuitry which is embedded in a molding compound. In some embodiments, such electronic circuitry may be electrically coupled together via electrically conductive traces and/or vias.


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