The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2018
Filed:
Nov. 14, 2014
Applicant:
United Technologies Corporation, Farmington, CT (US);
Inventors:
Wayde R. Schmidt, Pomfret Center, CT (US);
Slade R. Culp, Coventry, CT (US);
Assignee:
UNITED TECHNOLOGIES CORPORATION, Hartford, CT (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F01D 21/00 (2006.01); F01D 17/08 (2006.01); F01D 5/14 (2006.01); F01D 17/04 (2006.01); G01K 1/14 (2006.01); G01D 11/30 (2006.01); G01K 7/02 (2006.01); G01L 19/08 (2006.01); B32B 15/04 (2006.01); B32B 15/14 (2006.01); B32B 15/18 (2006.01); B64D 45/00 (2006.01); G01L 19/16 (2006.01); G01M 15/14 (2006.01); B22F 3/105 (2006.01); B22F 7/06 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); B23K 20/10 (2006.01);
U.S. Cl.
CPC ...
F01D 17/085 (2013.01); B32B 15/043 (2013.01); B32B 15/14 (2013.01); B32B 15/18 (2013.01); B64D 45/00 (2013.01); F01D 5/147 (2013.01); F01D 17/04 (2013.01); F01D 17/08 (2013.01); G01D 11/30 (2013.01); G01K 1/14 (2013.01); G01K 7/02 (2013.01); G01L 19/083 (2013.01); G01L 19/16 (2013.01); G01M 15/14 (2013.01); B22F 3/1055 (2013.01); B22F 7/06 (2013.01); B23K 20/103 (2013.01); B32B 2603/00 (2013.01); B32B 2605/18 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); B64D 2045/0085 (2013.01); F05D 2220/32 (2013.01); G01K 2205/00 (2013.01); Y02P 10/295 (2015.11); Y02T 50/672 (2013.01);
Abstract
One exemplary embodiment of this disclosure relates to an article having a multi-layer wall structure having an embedded sensor. Further, the multi-layer wall structure and the sensor are bonded together.