The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2018
Filed:
Sep. 26, 2014
Applicant:
Hitachi Metals, Ltd., Tokyo, JP;
Inventors:
Hideyuki Sagawa, Naka-gun, JP;
Keisuke Fujito, Mito, JP;
Takumi Sato, Hitachi, JP;
Hiromitsu Kuroda, Hitachi, JP;
Assignee:
HITACHI METALS, LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C25D 7/06 (2006.01); C25D 5/50 (2006.01);
U.S. Cl.
CPC ...
C25D 7/0614 (2013.01); C25D 5/50 (2013.01); Y10T 428/1266 (2015.01);
Abstract
A copper foil includes a copper-based metal sheet including mainly a copper, and a surface-treated layer that is provided on the copper-based metal sheet and includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper. A total thickness of the copper-based metal sheet and the surface-treated layer is less than 0.55 mm.