The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2018
Filed:
May. 24, 2016
Applicant:
Toyo Kohan Co., Ltd., Tokyo, JP;
Inventor:
Nobuaki Mukai, Yamaguchi, JP;
Assignee:
TOYO KOHAN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/18 (2006.01); C23C 18/44 (2006.01); B32B 15/01 (2006.01); H01M 8/0228 (2016.01); C23C 18/38 (2006.01); C23C 18/40 (2006.01); C23C 30/00 (2006.01); C23C 18/16 (2006.01); C23C 28/02 (2006.01); C23C 18/32 (2006.01); C23C 18/54 (2006.01); C23C 18/34 (2006.01); C23C 18/52 (2006.01); C23C 28/00 (2006.01); B32B 15/04 (2006.01); C23C 18/48 (2006.01); C23C 18/50 (2006.01); C23C 18/42 (2006.01); C22C 19/00 (2006.01); C22C 5/02 (2006.01); C22C 21/06 (2006.01); C23C 18/36 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1831 (2013.01); B32B 15/01 (2013.01); B32B 15/017 (2013.01); B32B 15/018 (2013.01); B32B 15/043 (2013.01); C22C 5/02 (2013.01); C22C 19/00 (2013.01); C22C 21/06 (2013.01); C23C 18/16 (2013.01); C23C 18/165 (2013.01); C23C 18/1633 (2013.01); C23C 18/1651 (2013.01); C23C 18/1653 (2013.01); C23C 18/32 (2013.01); C23C 18/34 (2013.01); C23C 18/38 (2013.01); C23C 18/40 (2013.01); C23C 18/42 (2013.01); C23C 18/44 (2013.01); C23C 18/48 (2013.01); C23C 18/50 (2013.01); C23C 18/52 (2013.01); C23C 18/54 (2013.01); C23C 28/00 (2013.01); C23C 28/02 (2013.01); C23C 28/021 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); H01M 8/0228 (2013.01); C23C 18/36 (2013.01); Y10T 428/1291 (2015.01); Y10T 428/12708 (2015.01); Y10T 428/12715 (2015.01); Y10T 428/12722 (2015.01); Y10T 428/12861 (2015.01); Y10T 428/12868 (2015.01); Y10T 428/12875 (2015.01); Y10T 428/12882 (2015.01); Y10T 428/12889 (2015.01); Y10T 428/12896 (2015.01); Y10T 428/12903 (2015.01); Y10T 428/12917 (2015.01); Y10T 428/12924 (2015.01); Y10T 428/12931 (2015.01); Y10T 428/12937 (2015.01); Y10T 428/12944 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/24975 (2015.01);
Abstract
A method of electroless gold plating includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by electroless reduction plating using a cyanide-free gold plating bath. The underlying alloy layer is formed of an M1-M2-M3 alloy, where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn, where Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and where Ru, and M3 is at least one element selected from P and B.