The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2018
Filed:
Jun. 24, 2014
Applicant:
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Inventors:
Masakazu Kandori, Tokyo, JP;
Yohei Hashimoto, Tokyo, JP;
Hiroshi Kishida, Tokyo, JP;
Rikiya Yamashita, Tokyo, JP;
Assignee:
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 175/16 (2006.01); C08L 63/00 (2006.01); C08G 18/67 (2006.01); C08G 18/81 (2006.01); H01M 2/02 (2006.01);
U.S. Cl.
CPC ...
C09J 175/16 (2013.01); C08G 18/672 (2013.01); C08G 18/8116 (2013.01); C08L 63/00 (2013.01); H01M 2/0287 (2013.01);
Abstract
A resin composition capable of securely adhering multiple members in a short time without having to establish a long aging process. The resin composition including: (1) a urethane (meth)acrylate; (2) at least one selected from a group of (meth)acrylates having a phosphate group, (meth)acrylic silane coupling agents, and (meth)acrylates having an isocyanate group; and (3) a (meth)acrylate having an epoxy group.