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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10005911 B1

PDFFull Text
Date of Patent:
Jun. 26, 2018

Filed:

Sep. 30, 2014

Curable composition for printed wiring board, and cured coating and printed wiring board using same

Applicant:

Taiyo Ink Mfg. Co., Ltd., Hiki-gun, JP;

Inventors:

Masayuki Shimura, Hiki-gun, JP;

Yoshiyuki Furuta, Hiki-gun, JP;

Masao Yumoto, Hiki-gun, JP;

Assignee:

TAIYO INK MFG. CO., LTD., Hiki-gun, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Betelhem Shewareged

Int. Cl.
CPC ...
C09D 4/00 (2006.01); C08F 2/48 (2006.01); C09D 133/06 (2006.01); H05K 3/28 (2006.01); C09D 11/101 (2014.01); C09D 11/322 (2014.01); C09D 11/38 (2014.01); C09D 5/00 (2006.01); H05K 1/03 (2006.01); C09D 7/40 (2018.01); C09D 7/61 (2018.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
C09D 4/00 (2013.01); C08F 2/48 (2013.01); C09D 5/00 (2013.01); C09D 7/40 (2018.01); C09D 7/61 (2018.01); C09D 11/101 (2013.01); C09D 11/322 (2013.01); C09D 11/38 (2013.01); C09D 133/066 (2013.01); H05K 1/0373 (2013.01); H05K 3/287 (2013.01); H05K 3/3452 (2013.01); H05K 2201/0209 (2013.01); H05K 2203/0759 (2013.01);
Abstract

Provided is a curable composition for a printed wiring board, which composition exhibits high physical strength as a coating film in terms of solder heat resistance, pencil hardness and the like and in which the components contained therein are not likely to precipitate in long-term storage even when the composition is configured to have a low viscosity and thereby made applicable to ink-jet printing, spin-coating and the like. The curable composition for a printed wiring board is characterized by comprising (A) a filler having a specific gravity of 3 or less, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator. The (A) filler having a specific gravity of 3 or less is preferably an inorganic filler.

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