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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10005901 B1

PDFFull Text
Date of Patent:
Jun. 26, 2018

Filed:

Aug. 20, 2013

Resin composition for sealing electrical electronic parts, method of producing electrical electronic parts, and sealed electrical electronic parts

Applicant:

Toyobo Co., Ltd., Osaka, JP;

Inventors:

Yosuke Watanabe, Shiga, JP;

Kenji Shiga, Shiga, JP;

Assignee:

TOYOBO CO., LTD., Osaka, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

David T Karst

Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08L 67/02 (2006.01); B29C 45/14 (2006.01); H01L 23/31 (2006.01); C08L 67/04 (2006.01); H01L 23/29 (2006.01); C08L 23/00 (2006.01); B29K 23/00 (2006.01); B29K 63/00 (2006.01); B29K 67/00 (2006.01); B29L 31/34 (2006.01); C08K 5/521 (2006.01);
U.S. Cl.
CPC ...
C08L 67/025 (2013.01); B29C 45/14008 (2013.01); C08L 23/00 (2013.01); C08L 63/00 (2013.01); C08L 67/04 (2013.01); H01L 23/293 (2013.01); H01L 23/3107 (2013.01); B29K 2023/00 (2013.01); B29K 2063/00 (2013.01); B29K 2067/00 (2013.01); B29L 2031/34 (2013.01); C08K 5/521 (2013.01); C08L 2201/02 (2013.01); C08L 2203/206 (2013.01); C08L 2205/03 (2013.01); C08L 2205/035 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Provided is a sealant for electrical and electronic parts having excellent fire resistance and adhesiveness, and provided are a method for manufacturing a sealant for electrical and electronic parts suitable therefor and a resin composition for sealing electrical and electronic parts. A resin composition for sealing electrical and electronic parts containing: a polyester (A) obtained by copolymerizing a polyalkylene glycol component and/or a polylactone component; an epoxy resin (B); a polyolefin resin (C); and a phosphoric acid ester (D).

Find Patent Forward Citations

Watanabe, Yosuke. (2018). Resin composition for sealing electrical electronic parts, method of producing electrical electronic parts, and sealed electrical electronic parts (U.S. Patent No. 10005901). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10005901

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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