The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2018

Filed:

Aug. 16, 2016
Applicants:

Raymond Miller Karam, Santa Barbara, CA (US);

Thomas Wynne, Santa Barbara, CA (US);

Anthony Thomas Chobot, Goleta, CA (US);

Inventors:

Raymond Miller Karam, Santa Barbara, CA (US);

Thomas Wynne, Santa Barbara, CA (US);

Anthony Thomas Chobot, Goleta, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); B32B 43/00 (2006.01); B32B 38/00 (2006.01); B01L 3/00 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); B01L 3/50273 (2013.01); B32B 38/0008 (2013.01); B32B 38/0036 (2013.01); B32B 43/00 (2013.01); B01L 2200/0689 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0887 (2013.01); B01L 2400/0481 (2013.01); B32B 2310/00 (2013.01); B32B 2439/80 (2013.01); B32B 2535/00 (2013.01); Y10T 156/1195 (2015.01); Y10T 156/1972 (2015.01);
Abstract

Embodiments generally relate to chips containing one or more hermetically sealed chambers that may be dismantled under controlled conditions using a release technique. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.


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