The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2018
Filed:
Aug. 20, 2015
Applicant:
The Boeing Company, Chicago, IL (US);
Inventors:
John D. Willams, Decatur, AL (US);
Andrew George Laquer, Tustin, CA (US);
Assignee:
The Boeing Company, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 47/00 (2006.01); B29C 47/06 (2006.01); B33Y 10/00 (2015.01); B29C 64/10 (2017.01); B29C 64/153 (2017.01); B22F 3/20 (2006.01); B22F 5/00 (2006.01); B22F 3/00 (2006.01); B22F 3/105 (2006.01); C22C 33/02 (2006.01); H01F 41/00 (2006.01); B29C 64/106 (2017.01); B29C 64/165 (2017.01); H01P 1/18 (2006.01); H01P 1/19 (2006.01); H01P 1/32 (2006.01); H01P 3/06 (2006.01); H01P 11/00 (2006.01); B29C 67/00 (2017.01); B33Y 70/00 (2015.01); B33Y 80/00 (2015.01); B29K 505/08 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 47/0004 (2013.01); B22F 3/008 (2013.01); B22F 3/1055 (2013.01); B22F 3/20 (2013.01); B22F 5/00 (2013.01); B29C 47/065 (2013.01); B29C 64/10 (2017.08); B29C 64/106 (2017.08); B29C 64/153 (2017.08); B29C 64/165 (2017.08); B29C 67/0055 (2013.01); B29C 67/0081 (2013.01); B33Y 10/00 (2014.12); C22C 33/02 (2013.01); H01F 41/00 (2013.01); H01P 1/183 (2013.01); H01P 1/19 (2013.01); H01P 1/32 (2013.01); H01P 3/06 (2013.01); H01P 11/005 (2013.01); B29K 2505/08 (2013.01); B29K 2995/0008 (2013.01); B29L 2031/34 (2013.01); B29L 2031/3462 (2013.01); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); Y02P 10/295 (2015.11);
Abstract
According to an embodiment, a method includes receiving a magnetic device design comprising a magnetic structure to be formed, at least in part, from a magnetic material matrix, wherein the magnetic material matrix is configured to be used in at least one of a magnetic materials additive manufacturing system (MMAMS) and a magnetic materials bulk extrusion system (MMBES); receiving the magnetic material matrix by at least one of the MMAMS and the MMBES; and dispensing the magnetic material matrix using at least one of the MMAMS and the MMBES to form the magnetic structure.