The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2018
Filed:
Jan. 30, 2015
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-Shi, Kyoto-fu, JP;
Inventors:
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/10 (2006.01); H05K 13/04 (2006.01); H01M 2/30 (2006.01); H01G 11/84 (2013.01); H01G 13/00 (2013.01); H01G 4/228 (2006.01); B23K 20/00 (2006.01); H01M 10/0525 (2010.01);
U.S. Cl.
CPC ...
B23K 20/106 (2013.01); B23K 20/002 (2013.01); B23K 20/10 (2013.01); H01G 4/228 (2013.01); H01G 11/84 (2013.01); H01G 13/00 (2013.01); H01G 13/006 (2013.01); H01M 2/30 (2013.01); H05K 13/046 (2013.01); H01M 10/0525 (2013.01); Y02E 60/13 (2013.01);
Abstract
A method for manufacturing an electronic device using ultrasonic joining, when the component members of the electronic device includes different structures. The method includes obtaining a joining condition that provides press-down amounts for the materials to be joined at predetermined values. The press-down amount generated by a horn and a supporting member biting into the materials during ultrasonic joining is predetermined for each specific structure of the component member of the electronic device.