The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2018

Filed:

Apr. 14, 2017
Applicant:

Futurewei Technologies, Inc., Plano, TX (US);

Inventors:

Jianmin Gong, Santa Clara, CA (US);

Heng Wang, Shenzhen, CN;

Shengping Li, Wuhan, CN;

Zhicheng Ye, Wuhan, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 13/00 (2006.01); H01S 3/04 (2006.01); G06F 1/20 (2006.01); H01L 23/34 (2006.01); H01L 23/36 (2006.01); H05K 1/02 (2006.01); F28D 1/02 (2006.01); F28D 1/00 (2006.01); F28F 3/02 (2006.01); F28F 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20454 (2013.01); F28F 13/00 (2013.01); G06F 1/20 (2013.01); H01S 3/0405 (2013.01); H05K 7/20 (2013.01); H05K 7/2039 (2013.01); H05K 7/20218 (2013.01); H05K 7/20254 (2013.01); H05K 7/20263 (2013.01); H05K 7/20272 (2013.01); F28D 1/00 (2013.01); F28D 1/02 (2013.01); F28F 3/00 (2013.01); F28F 3/02 (2013.01); F28F 2013/008 (2013.01); H01L 23/34 (2013.01); H01L 23/36 (2013.01); H05K 1/0201 (2013.01);
Abstract

An adaptive heat dissipation apparatus is provided, including two or more chamber walls forming a chamber volume having a first open side and a second open side, a heat source positioned at the first open side of the chamber volume, a heat conducting surface positioned at the second open side of the chamber volume, and a thermally-expansive material occupying a predetermined portion of the chamber volume. The thermally-expansive material expands to substantially fill the chamber volume at an ambient temperature above a predetermined temperature threshold and conducts heat from the heat source to the heat conducting surface. The thermally-expansive material contracts to leave an air gap when the ambient temperature is below the predetermined temperature threshold.


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