The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2018

Filed:

Oct. 02, 2015
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventor:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/02 (2006.01); G01V 8/12 (2006.01); G01S 17/08 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0284 (2013.01); G01S 17/08 (2013.01); G01V 8/12 (2013.01); H05K 2201/10378 (2013.01);
Abstract

A three-dimensional circuit substrate according to the present disclosure includes a base body and a wiring pattern formed on an outer surface of the base body. Also, the outer surface of the base body includes a mounting surface which faces the substrate when the three-dimensional circuit substrate is mounted onto the substrate, and an installation surface which is different from the mounting surface and is a surface where an electronic component is installable. Further, a recess is formed on a side where the mounting surface is provided in the base body.


Find Patent Forward Citations

Kobayashi, Mitsuru. (2018). Three-dimensional circuit substrate and sensor module using three-dimensional circuit substrate (U.S. Patent No. 10004140). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10004140

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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